Issued Patents 2021
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11139177 | Method of fabricating semiconductor package structure | Bor-Ping Jang, Chung-Shi Liu, Hsin-Hung Liao, Ying-Jui Huang | 2021-10-05 |
| 11133274 | Fan-out interconnect structure and method for forming same | Chen-Hua Yu, Yen-Chang Hu, Ching-Wen Hsiao, Mirng-Ji Lii, Chung-Shi Liu +2 more | 2021-09-28 |
| 11101232 | Conductive micro pin | Ying-Jui Huang, Chung-Shi Liu, Hsin-Hung Liao | 2021-08-24 |
| 11094561 | Semiconductor package structure | Bor-Ping Jang, Chung-Shi Liu, Hsin-Hung Liao, Ying-Jui Huang | 2021-08-17 |
| 11075439 | Electronic device and manufacturing method thereof | Pei-Hsuan Lee, Ching-Hua Hsieh, Yu-Ting Chiu, Jui-Chang Kuo | 2021-07-27 |
| 11024618 | Wafer-level underfill and over-molding | Bor-Ping Jang, Chung-Shi Liu, Yeong-Jyh Lin | 2021-06-01 |
| 11004758 | Integrated circuit package and method | Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Pei-Hsuan Lee +3 more | 2021-05-11 |
| 10985135 | Methods for controlling warpage in packaging | Bor-Ping Jang, Jen-Chun Liao, Yeong-Jyh Lin, Hsiao-Chung Liang, Chung-Shi Liu | 2021-04-20 |