Issued Patents 2021
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211346 | Semiconductor device and method of manufacture | Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai | 2021-12-28 |
| 11205636 | Semiconductor package and method of manufacturing the same | Shih-Wei Chen, Chih-Hua Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang | 2021-12-21 |
| 11201118 | Chip package and method of forming the same | Kuo Lung Pan, Hao-Yi Tsai | 2021-12-14 |
| 11183487 | Integrated circuit package and method | Chi-Hui Lai, Shu-Rong Chun, Kuo Lung Pan, Hao-Yi Tsai, Chung-Shi Liu +2 more | 2021-11-23 |
| 11177192 | Semiconductor device including heat dissipation structure and fabricating method of the same | Po-Yuan Teng, Chen-Hua Yu, Hao-Yi Tsai, Kuo-Chung Yee, Shih-Wei Chen | 2021-11-16 |
| 11164819 | Semiconductor package and manufacturing method thereof | Ying-Cheng Tseng, Hao-Yi Tsai, Chia-Hung Liu, Chi-Hui Lai | 2021-11-02 |
| 11158576 | Package structure having redistribution layer structures | Chih-Hao Chang, Hao-Yi Tsai, Tsung-Hsien Chiang | 2021-10-26 |
| 11121070 | Integrated fan-out package | Shu-Rong Chun, Chi-Hui Lai, Kuo Lung Pan, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2021-09-14 |
| 11121052 | Integrated fan-out device, 3D-IC system, and method | Yu-Chia Lai, Cheng-Chieh Hsieh, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu | 2021-09-14 |
| 11107771 | Segregated power and ground design for yield improvement | Shu-Rong Chun, Chi-Hui Lai, Kuo Lung Pan, Yu-Chia Lai, Hao-Yi Tsai +2 more | 2021-08-31 |
| 11107772 | Semiconductor package and method of manufacturing semiconductor package | Tsung-Hsien Chiang, Hsien-Ming Tu, Hao-Yi Tsai | 2021-08-31 |
| 11094634 | Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof | Chuei-Tang Wang, Chen-Hua Yu, Chung-Shi Liu, Chih-Yuan Chang, Jiun Yi Wu +1 more | 2021-08-17 |
| 11088110 | Semiconductor device, circuit board structure and manufacturing method thereof | Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Yu-Chia Lai, Po-Yuan Teng | 2021-08-10 |
| 11088125 | IPD modules with flexible connection scheme in packaging | Yu-Chia Lai, Cheng-Chieh Hsieh, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu | 2021-08-10 |
| 11062975 | Package structures | Yu-Chia Lai, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Kuo-Chung Yee | 2021-07-13 |
| 11049805 | Semiconductor package and method | Kuo Lung Pan, Shu-Rong Chun, Teng-Yuan Lo, Hung-Yi Kuo, Chih-Horng Chang +1 more | 2021-06-29 |
| 11043462 | Solderless interconnection structure and method of forming same | Yu-Wei Lin, Sheng-Yu Wu, Yu-Jen Tseng, Chen-Shien Chen | 2021-06-22 |
| 11011460 | Package structure, package-on-package structure and manufacturing method thereof | Chuei-Tang Wang | 2021-05-18 |
| 11004758 | Integrated circuit package and method | Shu-Rong Chun, Kuo Lung Pan, Hao-Yi Tsai, Pei-Hsuan Lee, Chien Ling Hwang +3 more | 2021-05-11 |
| 11004827 | Semiconductor package and manufacturing method of semiconductor package | Wei-Kang Hsieh, Hung-Yi Kuo, Hao-Yi Tsai, Kuo Lung Pan, Yu-Chia Lai +3 more | 2021-05-11 |
| 11004803 | Dummy dies for reducing warpage in packages | Chen-Hua Yu, Hao-Yi Tsai, Chung-Shi Liu | 2021-05-11 |
| 10985101 | Semiconductor package and manufacturing method thereof | Yu-Chia Lai, Chi-Hui Lai, Hao-Yi Tsai, Chung-Shi Liu, Kuo-Chung Yee +1 more | 2021-04-20 |
| 10985115 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Hao-Yi Tsai, Ching-Yao Lin, Teng-Yuan Lo, Chih-Yu Wang | 2021-04-20 |
| 10985114 | Scheme for connector site spacing and resulting structures | Yu-Feng Chen, Yen-Liang Lin, Sheng-Yu Wu, Chen-Shien Chen | 2021-04-20 |
| 10978382 | Integrated circuit package and method | Chi-Hui Lai, Shu-Rong Chun, Kuo Lung Pan, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2021-04-13 |