Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152258 | Method of forming an interconnect in a semiconductor device | Chih-Chien Chi, Yu Liu | 2021-10-19 |
| 11121046 | Wafer-level testing method and test structure thereof | Yu-Hsuan Huang, Chia-Chia Kan | 2021-09-14 |
| 11075439 | Electronic device and manufacturing method thereof | Ching-Hua Hsieh, Chien Ling Hwang, Yu-Ting Chiu, Jui-Chang Kuo | 2021-07-27 |
| 11037289 | Method and system for scanning wafer | Chien-Hsiang Huang, Kuang-Shing Chen, Kuan-Hsin Chen, Chun-Chieh Chin | 2021-06-15 |
| 11004758 | Integrated circuit package and method | Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Chien Ling Hwang +3 more | 2021-05-11 |