Issued Patents 2021
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201118 | Chip package and method of forming the same | Hao-Yi Tsai, Tin-Hao Kuo | 2021-12-14 |
| 11183487 | Integrated circuit package and method | Chi-Hui Lai, Shu-Rong Chun, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +2 more | 2021-11-23 |
| 11121070 | Integrated fan-out package | Shu-Rong Chun, Tin-Hao Kuo, Chi-Hui Lai, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2021-09-14 |
| 11107771 | Segregated power and ground design for yield improvement | Shu-Rong Chun, Tin-Hao Kuo, Chi-Hui Lai, Yu-Chia Lai, Hao-Yi Tsai +2 more | 2021-08-31 |
| 11049805 | Semiconductor package and method | Shu-Rong Chun, Teng-Yuan Lo, Hung-Yi Kuo, Chih-Horng Chang, Tin-Hao Kuo +1 more | 2021-06-29 |
| 11004827 | Semiconductor package and manufacturing method of semiconductor package | Wei-Kang Hsieh, Hung-Yi Kuo, Hao-Yi Tsai, Tin-Hao Kuo, Yu-Chia Lai +3 more | 2021-05-11 |
| 11004758 | Integrated circuit package and method | Shu-Rong Chun, Tin-Hao Kuo, Hao-Yi Tsai, Pei-Hsuan Lee, Chien Ling Hwang +3 more | 2021-05-11 |
| 10978382 | Integrated circuit package and method | Chi-Hui Lai, Shu-Rong Chun, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2021-04-13 |