Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11049805 | Semiconductor package and method | Kuo Lung Pan, Shu-Rong Chun, Hung-Yi Kuo, Chih-Horng Chang, Tin-Hao Kuo +1 more | 2021-06-29 |
| 10985115 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Hao-Yi Tsai, Tin-Hao Kuo, Ching-Yao Lin, Chih-Yu Wang | 2021-04-20 |