Issued Patents 2021
Showing 1–25 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211346 | Semiconductor device and method of manufacture | Chen-Hua Yu, Tin-Hao Kuo, Chung-Shi Liu | 2021-12-28 |
| 11205636 | Semiconductor package and method of manufacturing the same | Shih-Wei Chen, Chih-Hua Chen, Hsin-Yu Pan, Lipu Kris Chuang, Tin-Hao Kuo | 2021-12-21 |
| 11201118 | Chip package and method of forming the same | Kuo Lung Pan, Tin-Hao Kuo | 2021-12-14 |
| 11194990 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen +2 more | 2021-12-07 |
| 11183487 | Integrated circuit package and method | Chi-Hui Lai, Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Chung-Shi Liu +2 more | 2021-11-23 |
| 11177192 | Semiconductor device including heat dissipation structure and fabricating method of the same | Po-Yuan Teng, Chen-Hua Yu, Kuo-Chung Yee, Tin-Hao Kuo, Shih-Wei Chen | 2021-11-16 |
| 11177355 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Mirng-Ji Lii, Hung-Yi Kuo, Tsung-Yuan Yu, Min-Chien Hsiao +1 more | 2021-11-16 |
| 11171016 | Semiconductor package and manufacturing process thereof | Yu-Feng Chen, Chih-Hua Chen, Chen-Hua Yu, Chung-Shi Liu, Hung-Jui Kuo +1 more | 2021-11-09 |
| 11164819 | Semiconductor package and manufacturing method thereof | Ying-Cheng Tseng, Tin-Hao Kuo, Chia-Hung Liu, Chi-Hui Lai | 2021-11-02 |
| 11158555 | Package structure having sensor die with touch sensing electrode, and method of fabricating the same | Ting-Ting Kuo, Chih-Hua Chen, Yu-Chih Huang, Chia-Hung Liu, Chih-Hsuan Tai +1 more | 2021-10-26 |
| 11158576 | Package structure having redistribution layer structures | Chih-Hao Chang, Tsung-Hsien Chiang, Tin-Hao Kuo | 2021-10-26 |
| 11139249 | Semiconductor devices and methods of forming the same | Chen-Hua Yu, Hung-Yi Kuo, Chung-Shi Liu, Cheng-Chieh Hsieh, Tsung-Yuan Yu | 2021-10-05 |
| 11133269 | Semiconductor package and manufacturing method thereof | Chun-Ti Lu, Ming Hung Tseng, Tsung-Hsien Chiang, Yen-Liang Lin, Tzu-Sung Huang | 2021-09-28 |
| 11133236 | Polymer-based-semiconductor structure with cavity | Chen-Hua Yu, Hung-Yi Kuo | 2021-09-28 |
| 11121070 | Integrated fan-out package | Shu-Rong Chun, Tin-Hao Kuo, Chi-Hui Lai, Kuo Lung Pan, Chung-Shi Liu +1 more | 2021-09-14 |
| 11121052 | Integrated fan-out device, 3D-IC system, and method | Yu-Chia Lai, Cheng-Chieh Hsieh, Tin-Hao Kuo, Chung-Shi Liu, Chen-Hua Yu | 2021-09-14 |
| 11107772 | Semiconductor package and method of manufacturing semiconductor package | Tsung-Hsien Chiang, Hsien-Ming Tu, Tin-Hao Kuo | 2021-08-31 |
| 11107771 | Segregated power and ground design for yield improvement | Shu-Rong Chun, Tin-Hao Kuo, Chi-Hui Lai, Kuo Lung Pan, Yu-Chia Lai +2 more | 2021-08-31 |
| 11088125 | IPD modules with flexible connection scheme in packaging | Yu-Chia Lai, Cheng-Chieh Hsieh, Tin-Hao Kuo, Chung-Shi Liu, Chen-Hua Yu | 2021-08-10 |
| 11088110 | Semiconductor device, circuit board structure and manufacturing method thereof | Tin-Hao Kuo, Chen-Hua Yu, Chung-Shi Liu, Yu-Chia Lai, Po-Yuan Teng | 2021-08-10 |
| 11075176 | Semiconductor device and method | Tzu-Sung Huang, Chen-Hua Yu, Hung-Yi Kuo, Ming Hung Tseng | 2021-07-27 |
| 11062975 | Package structures | Yu-Chia Lai, Chen-Hua Yu, Chung-Shi Liu, Kuo-Chung Yee, Tin-Hao Kuo | 2021-07-13 |
| 11049850 | Methods of bonding the strip-shaped under bump metallization structures | Chih-Hsuan Tai, Chi-Hui Lai, Ying-Cheng Tseng, Ban-Li Wu, Ting-Ting Kuo +4 more | 2021-06-29 |
| 11049805 | Semiconductor package and method | Kuo Lung Pan, Shu-Rong Chun, Teng-Yuan Lo, Hung-Yi Kuo, Chih-Horng Chang +1 more | 2021-06-29 |
| 11010580 | Fingerprint sensor in InFO structure and formation method | Chih-Hua Chen, Yu-Feng Chen, Chung-Shi Liu, Chen-Hua Yu, Yu-Chih Huang | 2021-05-18 |