Issued Patents 2021
Showing 26–42 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11011501 | Package structure, package-on-package structure and method of fabricating the same | Chih-Hsuan Tai, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo, Ban-Li Wu +2 more | 2021-05-18 |
| 11004758 | Integrated circuit package and method | Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Pei-Hsuan Lee, Chien Ling Hwang +3 more | 2021-05-11 |
| 11004827 | Semiconductor package and manufacturing method of semiconductor package | Wei-Kang Hsieh, Hung-Yi Kuo, Kuo Lung Pan, Tin-Hao Kuo, Yu-Chia Lai +3 more | 2021-05-11 |
| 11004811 | Semiconductor structure | Vincent Chen, Hung-Yi Kuo, Chuei-Tang Wang, Chen-Hua Yu, Wei-Ting Chen +2 more | 2021-05-11 |
| 11004803 | Dummy dies for reducing warpage in packages | Chen-Hua Yu, Tin-Hao Kuo, Chung-Shi Liu | 2021-05-11 |
| 11004786 | Package structure and method of forming the same | Chih-Hsuan Tai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu +2 more | 2021-05-11 |
| 10991649 | Semiconductor device and method of manufacturing semiconductor device | Tsung-Yuan Yu, Chao-Wen Shih, Hung-Yi Kuo, Pi-Lan Chang | 2021-04-27 |
| 10985115 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Tin-Hao Kuo, Ching-Yao Lin, Teng-Yuan Lo, Chih-Yu Wang | 2021-04-20 |
| 10985101 | Semiconductor package and manufacturing method thereof | Yu-Chia Lai, Chi-Hui Lai, Tin-Hao Kuo, Chung-Shi Liu, Kuo-Chung Yee +1 more | 2021-04-20 |
| 10978363 | Semiconductor structure with conductive structure | Pei-Chun Tsai, Wei Sen Chang, Tin-Hao Kuo | 2021-04-13 |
| 10978382 | Integrated circuit package and method | Chi-Hui Lai, Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Chung-Shi Liu +1 more | 2021-04-13 |
| 10978362 | Semiconductor structure with conductive structure | Pei-Chun Tsai, Wei Sen Chang, Tin-Hao Kuo | 2021-04-13 |
| 10971463 | Interconnection structure including a metal post encapsulated by a joint material having concave outer surface | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang +2 more | 2021-04-06 |
| 10971477 | Semiconductor packages and methods of forming the same | Chen-Hua Yu, Ming Hung Tseng, Yen-Liang Lin, Tzu-Sung Huang, Tin-Hao Kuo | 2021-04-06 |
| 10950519 | Integrated circuit package and method | Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Chi-Ming Tsai, Chung-Shi Liu +2 more | 2021-03-16 |
| 10937734 | Conductive traces in semiconductor devices and methods of forming same | Chao-Wen Shih, Chen-Hua Yu, Han-Ping Pu, Hsin-Yu Pan, Sen-Kuei Hsu | 2021-03-02 |
| 10937718 | Package structures and method of forming the same | Chen-Hua Yu, Chih-Hua Chen, Yu-Feng Chen | 2021-03-02 |