Issued Patents 2021
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211358 | Packaged semiconductor devices and packaging methods | Tzu-Chun Tang, Chun-Lin Lu, Wei-Ting Chen, Vincent Chen, Shou-Zen Chang +1 more | 2021-12-28 |
| 11211371 | Integrated circuit package and method | Chen-Hua Yu, Wei Ling Chang, Chieh-Yen Chen | 2021-12-28 |
| 11211360 | Passive device module, semiconductor package including the same, and manufacturing method thereof | Shih-Ya Huang, Chung-Hao Tsai, Chen-Hua Yu | 2021-12-28 |
| 11211339 | Semiconductor device | Vincent Chen, Tzu-Chun Tang, Chen-Hua Yu, Ching-Feng Yang, Ming-Kai Liu +5 more | 2021-12-28 |
| 11195817 | Semiconductor package and manufacturing method thereof | Shih-Ya Huang, Chung-Hao Tsai, Chen-Hua Yu, Chih-Yuan Chang | 2021-12-07 |
| 11171088 | Electronic apparatus including antennas and directors | Tzu-Chun Tang, Chung-Hao Tsai, Chen-Hua Yu, Che-Wei Hsu | 2021-11-09 |
| 11139206 | Semiconductor device with conductive shielding structure | Chen-Hua Yu | 2021-10-05 |
| 11094671 | Package with thinned substrate | Chen-Hua Yu, Chung-Hao Tsai | 2021-08-17 |
| 11094682 | Package structure and method of fabricating the same | Rabiul Islam, Stefan Rusu, Weiwei Song | 2021-08-17 |
| 11094634 | Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof | Chen-Hua Yu, Chung-Shi Liu, Chih-Yuan Chang, Jiun Yi Wu, Jeng-Shien Hsieh +1 more | 2021-08-17 |
| 11075136 | Heat transfer structures and methods for IC packages | Ying-Chih Hsu, Alan Roth, Chih-Yuan Chang, Eric Soenen, Chih-Lin Chen | 2021-07-27 |
| 11063016 | Integrated fan-out package including voltage regulators and methods forming same | Chen-Hua Yu, Chih-Yuan Chang, Jeng-Shien Hsieh | 2021-07-13 |
| 11062998 | Semiconductor package and manufacturing method thereof | Chung-Hao Tsai, Chen-Hua Yu, Wei-Ting Chen, Chien-Hsun Chen, Shih-Ya Huang | 2021-07-13 |
| 11050153 | Encapsulating low-k dielectric blocks along with dies in an encapsulant to form antennas | Monsen Liu, Lai Wei Chih, Chung-Hao Tsai, Jeng-Shien Hsieh, En-Hsiang Yeh | 2021-06-29 |
| 11011460 | Package structure, package-on-package structure and manufacturing method thereof | Tin-Hao Kuo | 2021-05-18 |
| 11004811 | Semiconductor structure | Vincent Chen, Hung-Yi Kuo, Hao-Yi Tsai, Chen-Hua Yu, Wei-Ting Chen +2 more | 2021-05-11 |
| 10996410 | Methods of forming semiconductor packages | Jeng-Shien Hsieh, Hsing-Kuo Hsia, Chen-Hua Yu | 2021-05-04 |
| 10978781 | 3D antenna for integrated circuits | Jeng-Shien Hsieh, Chung-Hao Tsai, Chen-Hua Yu | 2021-04-13 |
| 10962711 | Semiconductor package and manufacturing method thereof | Chih-Chieh Chang, Chung-Hao Tsai, Chen-Hua Yu | 2021-03-30 |
| 10950553 | System on integrated chips and methods of forming the same | Chen-Hua Yu | 2021-03-16 |
| 10930628 | Photonic semiconductor device and method | Chih-Chieh Chang, Chung-Hao Tsai, Hsing-Kuo Hsia, Chen-Hua Yu | 2021-02-23 |