Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11050153 | Encapsulating low-k dielectric blocks along with dies in an encapsulant to form antennas | Lai Wei Chih, Chung-Hao Tsai, Jeng-Shien Hsieh, En-Hsiang Yeh, Chuei-Tang Wang | 2021-06-29 |