Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11094634 | Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof | Chuei-Tang Wang, Chen-Hua Yu, Chung-Shi Liu, Chih-Yuan Chang, Jiun Yi Wu +1 more | 2021-08-17 |
| 11063016 | Integrated fan-out package including voltage regulators and methods forming same | Chen-Hua Yu, Chih-Yuan Chang, Chuei-Tang Wang | 2021-07-13 |
| 11050153 | Encapsulating low-k dielectric blocks along with dies in an encapsulant to form antennas | Monsen Liu, Lai Wei Chih, Chung-Hao Tsai, En-Hsiang Yeh, Chuei-Tang Wang | 2021-06-29 |
| 10996410 | Methods of forming semiconductor packages | Chuei-Tang Wang, Hsing-Kuo Hsia, Chen-Hua Yu | 2021-05-04 |
| 10978781 | 3D antenna for integrated circuits | Chung-Hao Tsai, Chuei-Tang Wang, Chen-Hua Yu | 2021-04-13 |