Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195817 | Semiconductor package and manufacturing method thereof | Shih-Ya Huang, Chung-Hao Tsai, Chen-Hua Yu, Chuei-Tang Wang | 2021-12-07 |
| 11190198 | Switched capacitor circuit and capacitive DAC | Guan-Ying Huang | 2021-11-30 |
| 11094634 | Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof | Chuei-Tang Wang, Chen-Hua Yu, Chung-Shi Liu, Jiun Yi Wu, Jeng-Shien Hsieh +1 more | 2021-08-17 |
| 11095065 | Combination structure of socket of power supply device | — | 2021-08-17 |
| 11075136 | Heat transfer structures and methods for IC packages | Ying-Chih Hsu, Alan Roth, Chuei-Tang Wang, Eric Soenen, Chih-Lin Chen | 2021-07-27 |
| 11063016 | Integrated fan-out package including voltage regulators and methods forming same | Chen-Hua Yu, Chuei-Tang Wang, Jeng-Shien Hsieh | 2021-07-13 |
| 11062650 | Sensing circuit and a source driver of a display device | Feng-Lin Chan | 2021-07-13 |