Issued Patents 2021
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195788 | Hybrid dielectric scheme in packages | Chien-Hsun Chen, Chen-Hua Yu | 2021-12-07 |
| 11177218 | Package including metallic bolstering pattern and manufacturing method of the package | Chien-Hsun Lee, Shou-Yi Wang, Chien-Hsun Chen | 2021-11-16 |
| 11171090 | Semiconductor device and method of manufacture | Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu, Shou-Yi Wang, Chien-Hsun Chen | 2021-11-09 |
| 11152344 | Integrated circuit package and methods of forming same | Chen-Hua Yu, Kuo-Chung Yee, Mirng-Ji Lii, Chien-Hsun Lee | 2021-10-19 |
| 11145614 | Semiconductor device and method of manufacture | Chen-Hua Yu, Chung-Shi Liu | 2021-10-12 |
| 11133283 | Integrated fan-out device | Chen-Hua Yu, Chung-Shi Liu | 2021-09-28 |
| 11101209 | Redistribution structures in semiconductor packages and methods of forming same | Chung-Shi Liu, Chien-Hsun Lee, Hao-Cheng Hou, Hung-Jen Lin, Jung Wei Cheng +3 more | 2021-08-24 |
| 11094634 | Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof | Chuei-Tang Wang, Chen-Hua Yu, Chung-Shi Liu, Chih-Yuan Chang, Jeng-Shien Hsieh +1 more | 2021-08-17 |
| 11088059 | Package structure, RDL structure comprising redistribution layer having ground plates and signal lines and method of forming the same | Chien-Hsun Chen, Shou-Yi Wang | 2021-08-10 |
| 11069573 | Wafer level package structure and method of forming same | Chen-Hua Yu, Kuo-Chung Yee, Mirng-Ji Lii, Chien-Hsun Lee | 2021-07-20 |
| 11049802 | Semiconductor device and method of manufacture | Chen-Hua Yu | 2021-06-29 |
| 11006532 | Circuit carrier and manifacturing method thereof | Chien-Hsun Lee, Chen-Hua Yu, Chung-Shi Liu | 2021-05-11 |
| 10971446 | Semiconductor device and method of manufacture | Chen-Hua Yu, Chien-Hsun Chen | 2021-04-06 |
| 10937721 | Semiconductor structure | Chen-Hua Yu, Chung-Shi Liu, Chien-Hsun Lee | 2021-03-02 |
| 10937736 | Hybrid integrated circuit package and method | Chen-Hua Yu, Hsing-Kuo Hsia | 2021-03-02 |
| 10916519 | Method for manufacturing semiconductor package with connection structures including via groups | Chien-Hsun Chen, Chien-Hsun Lee, Chung-Shi Liu | 2021-02-09 |
| 10916529 | Electronics card including multi-chip module | Chen-Hua Yu, Chien-Hsun Lee | 2021-02-09 |
| 10888000 | Manufacturing method of circuit board and of semiconductor device including the same | Chien-Hsun Lee, Chen-Hua Yu, Chung-Shi Liu | 2021-01-05 |