Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177218 | Package including metallic bolstering pattern and manufacturing method of the package | Jiun Yi Wu, Chien-Hsun Lee, Chien-Hsun Chen | 2021-11-16 |
| 11171090 | Semiconductor device and method of manufacture | Jiun Yi Wu, Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu, Chien-Hsun Chen | 2021-11-09 |
| 11088059 | Package structure, RDL structure comprising redistribution layer having ground plates and signal lines and method of forming the same | Chien-Hsun Chen, Jiun Yi Wu | 2021-08-10 |