Issued Patents 2021
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211341 | Package structure and method of fabrcating the same | Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao +2 more | 2021-12-28 |
| 11177237 | Manufacturing method of semiconductor package | Meng-Tse Chen, Chung-Shi Liu, Chih-Wei Lin | 2021-11-16 |
| 11177156 | Semiconductor package, manufacturing method of semiconductor device and semiconductor package | Sheng-Chieh Yang, Shing-Chao Chen, Chih-Wei Lin | 2021-11-16 |
| 11171090 | Semiconductor device and method of manufacture | Jiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu, Shou-Yi Wang, Chien-Hsun Chen | 2021-11-09 |
| 11121089 | Integrated circuit package and method | Jen-Jui Yu, Hao-Jan Pei, Wei-Yu Chen, Chia-Lun Chang, Hsiu-Jen Lin | 2021-09-14 |
| 11088124 | Package and manufacturing method thereof | Shing-Chao Chen, Chih-Wei Lin, Sheng-Chieh Yang | 2021-08-10 |
| 11075131 | Semiconductor package and method of forming the same | Yi-Da Tsai, Chih-Wei Lin, Tsai-Tsung Tsai, Sheng-Chieh Yang, Chia-Min Lin | 2021-07-27 |
| 11075439 | Electronic device and manufacturing method thereof | Pei-Hsuan Lee, Chien Ling Hwang, Yu-Ting Chiu, Jui-Chang Kuo | 2021-07-27 |
| 11069671 | Semiconductor package and method | Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng +3 more | 2021-07-20 |
| 11069652 | Method of manufacturing semiconductor structure | Alexander Kalnitsky, Yi-Yang Lei, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang +9 more | 2021-07-20 |
| 11049832 | Formation method of package structure with warpage-control element | Hao-Jan Pei, Chih-Chiang Tsao, Wei-Yu Chen, Hsiu-Jen Lin, Ming-Da Cheng +1 more | 2021-06-29 |
| 11031376 | Chip package and method of forming the same | Hsaing-Pin Kuan, Chih-Wei Lin, Ching-Yao Lin, Chun-Yen Lan, Kai-Ming Chiang | 2021-06-08 |
| 11002927 | Package structure | Chia-Lun Chang, Cheng-Ting Chen, Hsiu-Jen Lin, Hsuan-Ting Kuo, Chia-Shen Cheng +1 more | 2021-05-11 |
| 10978370 | Integrated fan-out packages with embedded heat dissipation structure | Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen +4 more | 2021-04-13 |
| 10971475 | Semiconductor package structure | Jeng-Nan Hung, Chun-Hui Yu, Kuo-Chung Yee, Yi-Da Tsai, Wei-Hung Lin +1 more | 2021-04-06 |
| 10903090 | Method of singulate a package structure using a light transmitting film on a polymer layer | Cheng-Ting Chen, Hsiu-Jen Lin, Hao-Jan Pei, Wei-Yu Chen, Chia-Lun Chang +2 more | 2021-01-26 |