Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11075131 | Semiconductor package and method of forming the same | Ching-Hua Hsieh, Chih-Wei Lin, Tsai-Tsung Tsai, Sheng-Chieh Yang, Chia-Min Lin | 2021-07-27 |
| 10971475 | Semiconductor package structure | Jeng-Nan Hung, Chun-Hui Yu, Kuo-Chung Yee, Wei-Hung Lin, Ming-Da Cheng +1 more | 2021-04-06 |