Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11075131 | Semiconductor package and method of forming the same | Yi-Da Tsai, Ching-Hua Hsieh, Chih-Wei Lin, Sheng-Chieh Yang, Chia-Min Lin | 2021-07-27 |
| 11056474 | Semiconductor package, semiconductor device and method of forming the same | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Wei-Hung Lin, Ming-Da Cheng | 2021-07-06 |
| 10985122 | Semiconductor package system and method | Hui-Min Huang, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2021-04-20 |