Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177156 | Semiconductor package, manufacturing method of semiconductor device and semiconductor package | Shing-Chao Chen, Ching-Hua Hsieh, Chih-Wei Lin | 2021-11-16 |
| 11088124 | Package and manufacturing method thereof | Shing-Chao Chen, Ching-Hua Hsieh, Chih-Wei Lin | 2021-08-10 |
| 11075131 | Semiconductor package and method of forming the same | Yi-Da Tsai, Ching-Hua Hsieh, Chih-Wei Lin, Tsai-Tsung Tsai, Chia-Min Lin | 2021-07-27 |