Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11075131 | Semiconductor package and method of forming the same | Yi-Da Tsai, Ching-Hua Hsieh, Chih-Wei Lin, Tsai-Tsung Tsai, Sheng-Chieh Yang | 2021-07-27 |
CL
Chia-Min Lin
Overall (2021): #498,490 of 548,734Top 95%
1
Patents 2021