Issued Patents 2021
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211780 | Cable pass-through device | Chun Chang, Hsin-Chieh Lin, Yao-Long Lin | 2021-12-28 |
| 11194990 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2021-12-07 |
| 11177156 | Semiconductor package, manufacturing method of semiconductor device and semiconductor package | Sheng-Chieh Yang, Shing-Chao Chen, Ching-Hua Hsieh | 2021-11-16 |
| 11177237 | Manufacturing method of semiconductor package | Meng-Tse Chen, Ching-Hua Hsieh, Chung-Shi Liu | 2021-11-16 |
| 11133274 | Fan-out interconnect structure and method for forming same | Chen-Hua Yu, Yen-Chang Hu, Ching-Wen Hsiao, Mirng-Ji Lii, Chung-Shi Liu +2 more | 2021-09-28 |
| 11121104 | Method for manufacturing interconnect structure | Meng-Tse Chen, Hsiu-Jen Lin, Ming-Da Cheng, Chih-Hang Tung, Chung-Shi Liu | 2021-09-14 |
| 11101714 | Brushless DC motor fan | Chin-Chun Lai, Seng-En Mai, Kun-Fu Chuang | 2021-08-24 |
| 11101344 | Structure and formation method of semiconductor device structure with gate stack | Chih-Lin Wang, Kang-Min Kuo | 2021-08-24 |
| 11101261 | Package-on-package structures and methods for forming the same | Kuei-Wei Huang, Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2021-08-24 |
| 11088124 | Package and manufacturing method thereof | Shing-Chao Chen, Ching-Hua Hsieh, Sheng-Chieh Yang | 2021-08-10 |
| 11079814 | Mechanism for securing an add-in module in a computer device | Chao-Jung Chen | 2021-08-03 |
| 11075179 | Semiconductor device and method of forming the same | Wen-Hao Cheng, Yen-Yu Chen, Yi-Ming Dai | 2021-07-27 |
| 11075131 | Semiconductor package and method of forming the same | Yi-Da Tsai, Ching-Hua Hsieh, Tsai-Tsung Tsai, Sheng-Chieh Yang, Chia-Min Lin | 2021-07-27 |
| 11031376 | Chip package and method of forming the same | Hsaing-Pin Kuan, Ching-Hua Hsieh, Ching-Yao Lin, Chun-Yen Lan, Kai-Ming Chiang | 2021-06-08 |
| 10985122 | Semiconductor package system and method | Hui-Min Huang, Tsai-Tsung Tsai, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2021-04-20 |
| 10978370 | Integrated fan-out packages with embedded heat dissipation structure | Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen +4 more | 2021-04-13 |
| 10973149 | Streamlined air baffle for electronic device | Chao-Jung Chen, Yu-Nien Huang, Herman TAN | 2021-04-06 |
| 10964641 | Method of forming semiconductor packages having through package vias | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng | 2021-03-30 |
| 10950514 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Wei-Hung Lin, Ming-Da Cheng | 2021-03-16 |
| 10950519 | Integrated circuit package and method | Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai +2 more | 2021-03-16 |
| 10947417 | Thermal-curable adhesive composition and adhesive sheet | Chun-Ting Lai | 2021-03-16 |
| 10937872 | Semiconductor structures | Li-Che Chen, Chien-Hsien Song, Hung-Chih Tan | 2021-03-02 |
| 10916517 | Redistribution layer metallic structure and method | Shih Wei Bih, Sheng-Wei Yeh, Yen-Yu Chen, Wen-Hao Cheng, Chun-Chih Lin | 2021-02-09 |