Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11031376 | Chip package and method of forming the same | Ching-Hua Hsieh, Chih-Wei Lin, Ching-Yao Lin, Chun-Yen Lan, Kai-Ming Chiang | 2021-06-08 |
HK
Hsaing-Pin Kuan
Overall (2021): #429,603 of 548,734Top 80%
1
Patents 2021