Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121104 | Method for manufacturing interconnect structure | Meng-Tse Chen, Hsiu-Jen Lin, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu | 2021-09-14 |
| 11107747 | Semiconductor package with composite thermal interface material structure and method of forming the same | Tung-Liang Shao, Jen-Yu Wang, Chung-Jung Wu, Chen-Hua Yu | 2021-08-31 |
| 11101195 | Package structure and method for forming the same | Tung-Liang Shao, Wen-Lin Shih, Su-Chun Yang, Chen-Hua Yu | 2021-08-24 |
| 11056459 | Chip package structure and method for forming the same | Tung-Liang Shao, Su-Chun Yang, Geng-Ming CHANG, Chen-Hua Yu | 2021-07-06 |
| 11018215 | Package and manufacturing method thereof | Wen-Shiang Liao | 2021-05-25 |
| 10923417 | Integrated fan-out package with 3D magnetic core inductor | Wen-Shiang Liao, Chen-Hua Yu, Chewn-Pu Jou, Feng-Wei Kuo | 2021-02-16 |