Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11056459 | Chip package structure and method for forming the same | Chih-Hang Tung, Tung-Liang Shao, Su-Chun Yang, Chen-Hua Yu | 2021-07-06 |
GC
Geng-Ming CHANG
Overall (2021): #450,615 of 548,734Top 85%
1
Patents 2021