Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11101195 | Package structure and method for forming the same | Tung-Liang Shao, Wen-Lin Shih, Chih-Hang Tung, Chen-Hua Yu | 2021-08-24 |
| 11056459 | Chip package structure and method for forming the same | Chih-Hang Tung, Tung-Liang Shao, Geng-Ming CHANG, Chen-Hua Yu | 2021-07-06 |