Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107747 | Semiconductor package with composite thermal interface material structure and method of forming the same | Jen-Yu Wang, Chung-Jung Wu, Chih-Hang Tung, Chen-Hua Yu | 2021-08-31 |
| 11101195 | Package structure and method for forming the same | Wen-Lin Shih, Su-Chun Yang, Chih-Hang Tung, Chen-Hua Yu | 2021-08-24 |
| 11056459 | Chip package structure and method for forming the same | Chih-Hang Tung, Su-Chun Yang, Geng-Ming CHANG, Chen-Hua Yu | 2021-07-06 |
| 10985121 | Bump structure and fabricating method thereof | Chang-Pin Huang, Hsien-Ming Tu, Ching-Jung Yang, Yu-Chia Lai | 2021-04-20 |