Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10985121 | Bump structure and fabricating method thereof | Tung-Liang Shao, Hsien-Ming Tu, Ching-Jung Yang, Yu-Chia Lai | 2021-04-20 |
CH
Chang-Pin Huang
Overall (2021): #500,830 of 548,734Top 95%
1
Patents 2021