Issued Patents 2021
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183487 | Integrated circuit package and method | Chi-Hui Lai, Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai +2 more | 2021-11-23 |
| 11121052 | Integrated fan-out device, 3D-IC system, and method | Cheng-Chieh Hsieh, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu | 2021-09-14 |
| 11107771 | Segregated power and ground design for yield improvement | Shu-Rong Chun, Tin-Hao Kuo, Chi-Hui Lai, Kuo Lung Pan, Hao-Yi Tsai +2 more | 2021-08-31 |
| 11088110 | Semiconductor device, circuit board structure and manufacturing method thereof | Tin-Hao Kuo, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Po-Yuan Teng | 2021-08-10 |
| 11088125 | IPD modules with flexible connection scheme in packaging | Cheng-Chieh Hsieh, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu | 2021-08-10 |
| 11062975 | Package structures | Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Kuo-Chung Yee, Tin-Hao Kuo | 2021-07-13 |
| 11004827 | Semiconductor package and manufacturing method of semiconductor package | Wei-Kang Hsieh, Hung-Yi Kuo, Hao-Yi Tsai, Kuo Lung Pan, Tin-Hao Kuo +3 more | 2021-05-11 |
| 11004758 | Integrated circuit package and method | Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Pei-Hsuan Lee +3 more | 2021-05-11 |
| 10985101 | Semiconductor package and manufacturing method thereof | Chi-Hui Lai, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu, Kuo-Chung Yee +1 more | 2021-04-20 |
| 10985121 | Bump structure and fabricating method thereof | Chang-Pin Huang, Tung-Liang Shao, Hsien-Ming Tu, Ching-Jung Yang | 2021-04-20 |