Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11139249 | Semiconductor devices and methods of forming the same | Chen-Hua Yu, Hung-Yi Kuo, Chung-Shi Liu, Hao-Yi Tsai, Tsung-Yuan Yu | 2021-10-05 |
| 11121052 | Integrated fan-out device, 3D-IC system, and method | Yu-Chia Lai, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu | 2021-09-14 |
| 11088125 | IPD modules with flexible connection scheme in packaging | Yu-Chia Lai, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu | 2021-08-10 |
| 11004771 | Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices | Chi-Hsi Wu, Shin-Puu Jeng, Tsung-Yu Chen, Wensen Hung | 2021-05-11 |
| 10930605 | Contact pad for semiconductor device | Chang-Chia Huang, Tsung-Shu Lin, Wei-Cheng Wu | 2021-02-23 |
| 10910321 | Semiconductor device and method of making the same | Hau Tao, Yung-Tien Kuo | 2021-02-02 |