WW

Wei-Cheng Wu

TSMC: 34 patents #15 of 3,494Top 1%
PI Pro-Iroda Industries: 6 patents #1 of 2Top 50%
PI Pro-Lroda Industries: 4 patents #1 of 2Top 50%
GC Goldtek Technology Co.: 1 patents #3 of 4Top 75%
📍 Hsinchu, DE: #1 of 2 inventorsTop 50%
Overall (2021): #324 of 548,734Top 1%
45
Patents 2021

Issued Patents 2021

Showing 1–25 of 45 patents

Patent #TitleCo-InventorsDate
11211962 Sealing unit and wireless intercom device using the same LIH-SIN LEE 2021-12-28
11211388 Array boundfary structure to reduce dishing Meng-Han Lin, Te-Hsin Chiu, Li-Feng Teng, Chien-Hung Chang 2021-12-28
11209160 Combustion device having double-layer structure 2021-12-28
11205475 Static random access memory with a supplementary driver circuit and method of controlling the same Chih-Yu Lin, Kao-Cheng Lin, Yen-Huei Chen 2021-12-21
11195802 Semiconductor package including shielding plate in redistribution structure, semiconductor package including conductive via in redistribution structure, and manufacturing method thereof Chien-Chia Chiu, Cheng-Hsien Hsieh, Li-Han Hsu, Meng-Tsan Lee, Tsung-Shu Lin 2021-12-07
11189628 Trench gate high voltage transistor for embedded memory Alexander Kalnitsky, Chien-Hung Chang 2021-11-30
11177268 Memory device and manufacturing method thereof Chien-Hung Chang 2021-11-16
11169207 Testing of semiconductor chips with microbumps Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng, Chen-Hua Yu, Chao-Hsiang Yang 2021-11-09
11154158 Drip coffee bag holder 2021-10-26
11158644 Semiconductor device with field effect transistors of differing gate dielectric thickness on the same substrate and method of manufacturing the same Hung-Pin Ko 2021-10-26
11158546 Semiconductor arrangement and method of forming Harry-Hak-Lay Chuang, Chin-Yi Huang, Shih-Chang Liu 2021-10-26
11152312 Packages with interposers and methods for forming the same Sao-Ling Chiu, Kuo-Ching Hsu, Ping-Kang Huang, Shang-Yun Hou, Shin-Puu Jeng +1 more 2021-10-19
D932243 Combustion device 2021-10-05
11127626 Method of manufacturing a semiconductor device Jack Liu, Charles Chew-Yuen Young, Sing-Kai Huang 2021-09-21
11100964 Multi-stage bit line pre-charge Kao-Cheng Lin, Chih-Cheng Yu, Pei-Yuan Li, Chien-Chen Lin, Wei Min Chan +1 more 2021-08-24
11094641 Fan-out package having a main die and a dummy die Yan-Fu Lin, Chen-Hua Yu, Meng-Tsan Lee, Hsien-Wei Chen 2021-08-17
11079104 Flame-resistant wick 2021-08-03
11081372 Package system for integrated circuits Shang-Yun Hou, Shin-Puu Jeng, Chen-Hua Yu 2021-08-03
11069419 Test line letter for embedded non-volatile memory technology Jui-Tsung Lien, Fang-Lan Chu, Hong-Da Lin, Ku-Ning Chang, Yu-Chen Wang 2021-07-20
D925319 Holder for gas tool 2021-07-20
11069693 Method for improving control gate uniformity during manufacture of processors with embedded flash memory Meng-Han Lin 2021-07-20
11069625 Method for forming package structure Cheng-Hsien Hsieh, Li-Han Hsu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu 2021-07-20
11063058 Memory device with metal gate Harry-Hak-Lay Chuang, Ya-Chen Kao 2021-07-13
11063044 Metal gate modulation to improve kink effect Meng-Han Lin, Te-Hsin Chiu 2021-07-13
11056566 Split gate memory device and method of fabricating the same Chang-Ming Wu, Shih-Chang Liu, Harry-Hak-Lay Chuang, Chia-Shiung Tsai 2021-07-06