Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152312 | Packages with interposers and methods for forming the same | Sao-Ling Chiu, Wei-Cheng Wu, Ping-Kang Huang, Shang-Yun Hou, Shin-Puu Jeng +1 more | 2021-10-19 |
| 11075173 | Semiconductor device and method of forming same | Chih-Hsiang Tseng, Yu-Feng Chen, Cheng-Jen Lin, Wen-Hsiung Lu, Ming-Da Cheng +4 more | 2021-07-27 |
| 11069539 | 3D packages and methods for forming the same | Tzu-Wei Chiu, Cheng-Hsien Hsieh, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng | 2021-07-20 |
| 10985124 | Semiconductor structure and manufacturing method thereof | Kuo-Chin Chang, Yen-Kun Lai, Mirng-Ji Lii | 2021-04-20 |