Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152312 | Packages with interposers and methods for forming the same | Kuo-Ching Hsu, Wei-Cheng Wu, Ping-Kang Huang, Shang-Yun Hou, Shin-Puu Jeng +1 more | 2021-10-19 |
| 11107758 | Fan-out package structure and method | Tzu-Wei Chiu | 2021-08-31 |
| 10978346 | Conductive vias in semiconductor packages and methods of forming same | Sung-Hui Huang, Hung-Pin Chang, Shang-Yun Hou, Wan-Yu Lee | 2021-04-13 |
| 10978404 | Semiconductor structure and method for fabricating semiconductor structure | Chung-Yu Lu, Yao-Jen Chang | 2021-04-13 |