Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11004832 | System, structure, and method of manufacturing a semiconductor substrate stack | Weng-Jin Wu, Wen-Chih Chiou, Chen-Hua Yu | 2021-05-11 |
| 10978346 | Conductive vias in semiconductor packages and methods of forming same | Sung-Hui Huang, Sao-Ling Chiu, Shang-Yun Hou, Wan-Yu Lee | 2021-04-13 |