Issued Patents 2021
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145623 | Integrated circuit packages and methods of forming the same | Chia-Hao Hsu, Yung-Chi Lin | 2021-10-12 |
| 11101240 | Isolation bonding film for semiconductor packages and methods of forming the same | Ming-Tsu Chung, Ku-Feng Yang, Yung-Chi Lin, Chen-Hua Yu | 2021-08-24 |
| 11063008 | Semiconductor structure and manufacturing method thereof | Yung-Chi Lin, Chen-Hua Yu, Tsang-Jiuh Wu | 2021-07-13 |
| 11056419 | Semiconductor device having backside interconnect structure on through substrate via and method of forming the same | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih +3 more | 2021-07-06 |
| 11043481 | Method of manufacturing semiconductor package structure | Yi-Hsiu Chen, Chen-Hua Yu, Ming-Fa Chen | 2021-06-22 |
| 11037904 | Singulation and bonding methods and structures formed thereby | Chen-Hua Yu, Tsang-Jiuh Wu | 2021-06-15 |
| 11004832 | System, structure, and method of manufacturing a semiconductor substrate stack | Hung-Pin Chang, Weng-Jin Wu, Chen-Hua Yu | 2021-05-11 |
| 11004741 | Profile of through via protrusion in 3DIC interconnect | Jiung Wu, Kuan-Liang Lai, Ming-Tsu Chung, Hong-Ye Shih, Ku-Feng Yang +3 more | 2021-05-11 |
| 10978424 | Semiconductor device and manufacturing method thereof | Chen-Hua Yu | 2021-04-13 |
| 10971417 | 3D stacked-chip package | Chen-Hua Yu, Ming-Fa Chen, Wen-Sen Lu, Wen-Ching Tsai | 2021-04-06 |
| 10914895 | Package structure and manufacturing method thereof | Yu-Kuang Liao, Cheng-Chun Tsai, Chen-Hua Yu, Fang Chen, Ping-Jung Wu | 2021-02-09 |
| 10910267 | Alignment marks in substrate having through-substrate via (TSV) | Hsin Chang, Fang Wen Tsai, Jing-Cheng Lin, Shin-Puu Jeng | 2021-02-02 |