Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10910267 | Alignment marks in substrate having through-substrate via (TSV) | Fang Wen Tsai, Jing-Cheng Lin, Wen-Chih Chiou, Shin-Puu Jeng | 2021-02-02 |
HC
Hsin Chang
Overall (2021): #429,803 of 548,734Top 80%
1
Patents 2021