Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11004741 | Profile of through via protrusion in 3DIC interconnect | Kuan-Liang Lai, Ming-Tsu Chung, Hong-Ye Shih, Ku-Feng Yang, Tsang-Jiuh Wu +3 more | 2021-05-11 |
JW
Jiung Wu
Overall (2021): #403,690 of 548,734Top 75%
1
Patents 2021