Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171100 | Semiconductor device structure with protected bump and method of forming the same | Hui-Min Huang, Wei-Hung Lin, Wen-Hsiung Lu, Ming-Da Cheng, Chang-Jung Hsueh | 2021-11-09 |
| 11004741 | Profile of through via protrusion in 3DIC interconnect | Jiung Wu, Ming-Tsu Chung, Hong-Ye Shih, Ku-Feng Yang, Tsang-Jiuh Wu +3 more | 2021-05-11 |