Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171100 | Semiconductor device structure with protected bump and method of forming the same | Hui-Min Huang, Wei-Hung Lin, Wen-Hsiung Lu, Ming-Da Cheng, Kuan-Liang Lai | 2021-11-09 |
| 11094655 | Semiconductor structure and method for forming the same | Wen-Hsiung Lu, Chin Wei Kang, Hui-Min Huang, Wei-Hung Lin, Cheng-Jen Lin +2 more | 2021-08-17 |
| 11004685 | Multi-layer structures and methods of forming | Chen-En Yen, Chin Wei Kang, Kai Jun Zhan, Wei-Hung Lin, Cheng-Jen Lin +3 more | 2021-05-11 |