Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177137 | Wafer etching process and methods thereof | Hui-Min Huang, Ming-Da Cheng, Wei-Hung Lin, Chen-En Yen, Hsu-Lun Liu | 2021-11-16 |
| 11171100 | Semiconductor device structure with protected bump and method of forming the same | Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng, Chang-Jung Hsueh, Kuan-Liang Lai | 2021-11-09 |
| 11152319 | Micro-connection structure and manufacturing method thereof | Chen-Shien Chen, Chen-En Yen, Cheng-Jen Lin, Chin Wei Kang, Kai Jun Zhan | 2021-10-19 |
| 11101233 | Semiconductor device and method for forming the same | Chen-En Yen, Chin Wei Kang, Kai Jun Zhan, Cheng-Jen Lin, Ming-Da Cheng +1 more | 2021-08-24 |
| 11094655 | Semiconductor structure and method for forming the same | Chang-Jung Hsueh, Chin Wei Kang, Hui-Min Huang, Wei-Hung Lin, Cheng-Jen Lin +2 more | 2021-08-17 |
| 11075173 | Semiconductor device and method of forming same | Chih-Hsiang Tseng, Yu-Feng Chen, Cheng-Jen Lin, Ming-Da Cheng, Kuo-Ching Hsu +4 more | 2021-07-27 |
| 11043463 | Interconnect structures and methods of forming same | Hsuan-Ting Kuo, Tsung-Yuan Yu, Hsien-Wei Chen, Ming-Da Cheng, Chung-Shi Liu | 2021-06-22 |