Issued Patents 2021
Showing 1–25 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195810 | Bonding structure and method of forming same | Jie Chen, Ming-Fa Chen | 2021-12-07 |
| 11195804 | Semiconductor structure | Ying-Ju Chen, Ming-Fa Chen | 2021-12-07 |
| 11183475 | Semiconductor structure | Jie Chen, Ying-Ju Chen | 2021-11-23 |
| 11183454 | Functional component within interconnect structure of semiconductor device and method of forming same | Ming-Fa Chen | 2021-11-23 |
| 11177200 | Pad design for reliability enhancement in packages | Jie Chen | 2021-11-16 |
| 11177238 | Semiconductor structure | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, An-Jhih Su, Tien-Chung Yang | 2021-11-16 |
| 11177201 | Semiconductor packages including routing dies and methods of forming same | Jie Chen, Ying-Ju Chen | 2021-11-16 |
| 11171120 | Integrated circuit package assembly | — | 2021-11-09 |
| 11164832 | Package with UBM and methods of forming | Li-Hsien Huang | 2021-11-02 |
| 11164857 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Jie Chen, Ying-Ju Chen | 2021-11-02 |
| 11152323 | Package with UBM and methods of forming | Chen-Hua Yu, Chien-Yu Li, Hung-Jui Kuo, Li-Hsien Huang, Der-Chyang Yeh +2 more | 2021-10-19 |
| 11145622 | Discrete polymer in fan-out packages | Jie Chen | 2021-10-12 |
| 11133197 | Semiconductor structure and method of forming | Wei-Yu Chen, Tien-Chung Yang, An-Jhih Su | 2021-09-28 |
| 11133304 | Packaging scheme involving metal-insulator-metal capacitor | Hsiang-Ku Shen, Ying-Ju Chen | 2021-09-28 |
| 11121084 | Integrated circuit device with through interconnect via and methods of manufacturing the same | Ching-Jung Yang, Jie Chen, Ming-Fa Chen | 2021-09-14 |
| 11114433 | 3DIC structure and method of fabricating the same | Ming-Fa Chen | 2021-09-07 |
| 11107680 | Mask assembly and method for fabricating a chip package | Jie Chen, Tzuan-Horng Liu, Ying-Ju Chen | 2021-08-31 |
| 11107779 | Semiconductor package and manufacturing method thereof | Ming-Fa Chen, Sen-Bor Jan, Chih-Chia Hu | 2021-08-31 |
| 11094622 | Packaged semiconductor devices and methods of packaging thereof | — | 2021-08-17 |
| 11094641 | Fan-out package having a main die and a dummy die | Yan-Fu Lin, Chen-Hua Yu, Meng-Tsan Lee, Wei-Cheng Wu | 2021-08-17 |
| 11094613 | Semiconductor structure and manufacturing method thereof | Chih-Chia Hu, Ming-Fa Chen, Sen-Bor Jan | 2021-08-17 |
| 11088041 | Semiconductor packages with shortened talking path | Jie Chen, Ming-Fa Chen, Chih-Chia Hu | 2021-08-10 |
| 11081391 | Wafer level dicing method and semiconductor device | Ying-Ju Chen | 2021-08-03 |
| 11075182 | Semiconductor package and method of forming the same | An-Jhih Su | 2021-07-27 |
| 11069625 | Method for forming package structure | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Der-Chyang Yeh, Chi-Hsi Wu | 2021-07-20 |