Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195802 | Semiconductor package including shielding plate in redistribution structure, semiconductor package including conductive via in redistribution structure, and manufacturing method thereof | Wei-Cheng Wu, Chien-Chia Chiu, Cheng-Hsien Hsieh, Li-Han Hsu, Tsung-Shu Lin | 2021-12-07 |
| 11094641 | Fan-out package having a main die and a dummy die | Yan-Fu Lin, Chen-Hua Yu, Wei-Cheng Wu, Hsien-Wei Chen | 2021-08-17 |
| 11031352 | Routing design of dummy metal cap and redistribution line | Chen-Hua Yu, Hsien-Wei Chen, Tsung-Shu Lin, Wei-Cheng Wu, Chien-Chia Chiu +1 more | 2021-06-08 |