Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195802 | Semiconductor package including shielding plate in redistribution structure, semiconductor package including conductive via in redistribution structure, and manufacturing method thereof | Wei-Cheng Wu, Chien-Chia Chiu, Li-Han Hsu, Meng-Tsan Lee, Tsung-Shu Lin | 2021-12-07 |
| 11069539 | 3D packages and methods for forming the same | Tzu-Wei Chiu, Hsien-Pin Hu, Kuo-Ching Hsu, Shang-Yun Hou, Shin-Puu Jeng | 2021-07-20 |
| 11069625 | Method for forming package structure | Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu | 2021-07-20 |
| 11018088 | Dummy features in redistribution layers (RDLS) and methods of forming same | Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2021-05-25 |
| 10950577 | Redistribution layers in semiconductor packages and methods of forming same | Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2021-03-16 |
| 10939551 | Opening in the pad for bonding integrated passive device in InFO package | Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Li-Han Hsu +1 more | 2021-03-02 |