Issued Patents 2021
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201142 | Semiconductor package, package on package structure and method of froming package on package structure | Li-Hsien Huang, Chi-Hsi Wu, Chen-Hua Yu, Hua-Wei Tseng, Ming-Chih Yew +2 more | 2021-12-14 |
| 11189603 | Semiconductor packages and methods of forming same | Chen-Hua Yu, Han-Ping Pu | 2021-11-30 |
| 11177238 | Semiconductor structure | Chen-Hua Yu, Chi-Hsi Wu, Hsien-Wei Chen, An-Jhih Su, Tien-Chung Yang | 2021-11-16 |
| 11177142 | Method for dicing integrated fan-out packages without seal rings | Li-Hsien Huang, Yueh-Ting Lin, An-Jhih Su, Ming-Shih Yeh | 2021-11-16 |
| 11158619 | Redistribution layers in semiconductor packages and methods of forming same | Li-Hsien Huang, An-Jhih Su, Chi-Hsi Wu, Chen-Hua Yu | 2021-10-26 |
| 11152323 | Package with UBM and methods of forming | Chen-Hua Yu, Chien-Yu Li, Hung-Jui Kuo, Li-Hsien Huang, Hsien-Wei Chen +2 more | 2021-10-19 |
| 11133258 | Package with bridge die for interconnection and method forming same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Ming-Shih Yeh, Tsung-Shu Lin | 2021-09-28 |
| 11094680 | Packages and methods of forming packages | Chen-Hua Yu, An-Jhih Su | 2021-08-17 |
| 11075150 | Semiconductor package and method of manufacturing the same | Li-Hsien Huang, An-Jhih Su, Hua-Wei Tseng, Chiang-Hung Lin, Ming-Shih Yeh | 2021-07-27 |
| 11069625 | Method for forming package structure | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Chi-Hsi Wu | 2021-07-20 |
| 11062978 | Semiconductor package and method | Wei-Yu Chen, An-Jhih Su, Li-Hsien Huang, Ming-Shih Yeh | 2021-07-13 |
| 11056433 | Redistribution layer structures for integrated circuit package | Jie Chen, Ying-Ju Chen, Hsien-Wei Chen, Chen-Hua Yu | 2021-07-06 |
| 11056464 | Packages with metal line crack prevention design | Chen-Hua Yu, Shin-Puu Jeng, Hsien-Wei Chen, Jie Chen | 2021-07-06 |
| 11037861 | Interconnect structure for package-on-package devices | Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Yi-Jou Lin, Shuo-Mao Chen +1 more | 2021-06-15 |
| 11037819 | Wafer level chip scale packaging intermediate structure apparatus and method | Chen-Hua Yu | 2021-06-15 |
| 11018088 | Dummy features in redistribution layers (RDLS) and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Chi-Hsi Wu +1 more | 2021-05-25 |
| 11018069 | Underfill control structures and method | Ying-Ju Chen, An-Jhih Su, Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu | 2021-05-25 |
| 11004818 | Package with passive devices and method of forming the same | Shuo-Mao Chen, Li-Hsien Huang | 2021-05-11 |
| 10992100 | Semiconductor device and method | Chen-Hua Yu, An-Jhih Su, Chia-Nan Yuan, Shih-Guo Shen, Yu-Hung Lin +1 more | 2021-04-27 |
| 10971371 | Multi-chip structure and method of forming same | Chen-Hua Yu | 2021-04-06 |
| 10971441 | Package with metal-insulator-metal capacitor and method of manufacturing the same | Shuo-Mao Chen, Chiung-Han Yeh | 2021-04-06 |
| 10964666 | Chip on package structure and method | Chen-Hua Yu, Kuo-Chung Yee, Jui-Pin Hung | 2021-03-30 |
| 10950577 | Redistribution layers in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Chi-Hsi Wu +1 more | 2021-03-16 |
| 10950575 | Package structure and method of forming the same | Chen-Hua Yu, Li-Hsien Huang, Chi-Hsi Wu, Hsien-Wei Chen, An-Jhih Su +1 more | 2021-03-16 |
| 10943798 | Fan-out structure and method of fabricating the same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Hsien-Wei Chen, Wei-Yu Chen | 2021-03-09 |