Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201142 | Semiconductor package, package on package structure and method of froming package on package structure | Li-Hsien Huang, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Ming-Chih Yew +2 more | 2021-12-14 |
| 11088094 | Air channel formation in packaging process | Wan-Yu Lee, Chiang Lin, Yueh-Ting Lin, Li-Hsien Huang, Yu-Hsiang Hu | 2021-08-10 |
| 11075150 | Semiconductor package and method of manufacturing the same | Li-Hsien Huang, An-Jhih Su, Der-Chyang Yeh, Chiang-Hung Lin, Ming-Shih Yeh | 2021-07-27 |
| 10950575 | Package structure and method of forming the same | Chen-Hua Yu, Li-Hsien Huang, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen +1 more | 2021-03-16 |