Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177142 | Method for dicing integrated fan-out packages without seal rings | Li-Hsien Huang, An-Jhih Su, Ming-Shih Yeh, Der-Chyang Yeh | 2021-11-16 |
| 11088094 | Air channel formation in packaging process | Wan-Yu Lee, Chiang Lin, Hua-Wei Tseng, Li-Hsien Huang, Yu-Hsiang Hu | 2021-08-10 |