Issued Patents 2021
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201142 | Semiconductor package, package on package structure and method of froming package on package structure | Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Hua-Wei Tseng, Ming-Chih Yew +2 more | 2021-12-14 |
| 11177142 | Method for dicing integrated fan-out packages without seal rings | Yueh-Ting Lin, An-Jhih Su, Ming-Shih Yeh, Der-Chyang Yeh | 2021-11-16 |
| 11164832 | Package with UBM and methods of forming | Hsien-Wei Chen | 2021-11-02 |
| 11158619 | Redistribution layers in semiconductor packages and methods of forming same | An-Jhih Su, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh | 2021-10-26 |
| 11152323 | Package with UBM and methods of forming | Chen-Hua Yu, Chien-Yu Li, Hung-Jui Kuo, Hsien-Wei Chen, Der-Chyang Yeh +2 more | 2021-10-19 |
| 11145633 | Semiconductor package and manufacturing method thereof | Wei-Yu Chen, An-Jhih Su, Tien-Chung Yang, Ming-Shih Yeh | 2021-10-12 |
| 11088094 | Air channel formation in packaging process | Wan-Yu Lee, Chiang Lin, Yueh-Ting Lin, Hua-Wei Tseng, Yu-Hsiang Hu | 2021-08-10 |
| 11075150 | Semiconductor package and method of manufacturing the same | An-Jhih Su, Der-Chyang Yeh, Hua-Wei Tseng, Chiang-Hung Lin, Ming-Shih Yeh | 2021-07-27 |
| 11062978 | Semiconductor package and method | Wei-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Ming-Shih Yeh | 2021-07-13 |
| 11037899 | Package structures and methods of forming the same | An-Jhih Su, Hsien-Wei Chen | 2021-06-15 |
| 11018025 | Redistribution lines having stacking vias | Hsien-Wei Chen | 2021-05-25 |
| 11004818 | Package with passive devices and method of forming the same | Shuo-Mao Chen, Der-Chyang Yeh | 2021-05-11 |
| 10950575 | Package structure and method of forming the same | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, An-Jhih Su +1 more | 2021-03-16 |