Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11075150 | Semiconductor package and method of manufacturing the same | Li-Hsien Huang, An-Jhih Su, Der-Chyang Yeh, Hua-Wei Tseng, Ming-Shih Yeh | 2021-07-27 |
CL
Chiang-Hung Lin
Overall (2021): #498,537 of 548,734Top 95%
1
Patents 2021