Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201142 | Semiconductor package, package on package structure and method of froming package on package structure | Li-Hsien Huang, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Hua-Wei Tseng +2 more | 2021-12-14 |
| 11177142 | Method for dicing integrated fan-out packages without seal rings | Li-Hsien Huang, Yueh-Ting Lin, An-Jhih Su, Der-Chyang Yeh | 2021-11-16 |
| 11145633 | Semiconductor package and manufacturing method thereof | Wei-Yu Chen, An-Jhih Su, Li-Hsien Huang, Tien-Chung Yang | 2021-10-12 |
| 11133258 | Package with bridge die for interconnection and method forming same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Tsung-Shu Lin | 2021-09-28 |
| 11075150 | Semiconductor package and method of manufacturing the same | Li-Hsien Huang, An-Jhih Su, Der-Chyang Yeh, Hua-Wei Tseng, Chiang-Hung Lin | 2021-07-27 |
| 11062978 | Semiconductor package and method | Wei-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Li-Hsien Huang | 2021-07-13 |
| 10992100 | Semiconductor device and method | Chen-Hua Yu, An-Jhih Su, Chia-Nan Yuan, Shih-Guo Shen, Der-Chyang Yeh +1 more | 2021-04-27 |