Issued Patents 2021
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195802 | Semiconductor package including shielding plate in redistribution structure, semiconductor package including conductive via in redistribution structure, and manufacturing method thereof | Wei-Cheng Wu, Chien-Chia Chiu, Cheng-Hsien Hsieh, Li-Han Hsu, Meng-Tsan Lee | 2021-12-07 |
| 11133258 | Package with bridge die for interconnection and method forming same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh | 2021-09-28 |
| 11088079 | Package structure having line connected via portions | Chih-Kai Cheng, Tsung-Yu Chen, Hsien-Pin Hu, Wen-Hsin Wei | 2021-08-10 |
| 11088048 | Semiconductor structure | Chi-Hsi Wu, Wensen Hung, Shih-Chang Ku, Tsung-Yu Chen, Hung-Chi Li | 2021-08-10 |
| 11069642 | Package structure and method of manufacturing the same | Hsuan-Ning Shih | 2021-07-20 |
| 11062971 | Package structure and method and equipment for forming the same | Wensen Hung, Tsung-Yu Chen, Chen-Hsiang Lao, Wen-Hsin Wei, Hsien-Pin Hu | 2021-07-13 |
| 11031352 | Routing design of dummy metal cap and redistribution line | Chen-Hua Yu, Hsien-Wei Chen, Meng-Tsan Lee, Wei-Cheng Wu, Chien-Chia Chiu +1 more | 2021-06-08 |
| 11018073 | Heat spreading device and method | Wensen Hung, Hung-Chi Li, Tsung-Yu Chen | 2021-05-25 |
| 11011451 | Integrated circuit package and method | Yuan Sheng Chiu, Chih-Kai Cheng | 2021-05-18 |
| 10978373 | Semiconductor device methods of manufacture | Shih-Chang Ku, Hung-Chi Li, Tsung-Yu Chen, Wensen Hung | 2021-04-13 |
| 10930605 | Contact pad for semiconductor device | Chang-Chia Huang, Cheng-Chieh Hsieh, Wei-Cheng Wu | 2021-02-23 |