Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133237 | Package with embedded heat dissipation features | Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2021-09-28 |
| 11088048 | Semiconductor structure | Chi-Hsi Wu, Tsung-Shu Lin, Shih-Chang Ku, Tsung-Yu Chen, Hung-Chi Li | 2021-08-10 |
| 11062971 | Package structure and method and equipment for forming the same | Tsung-Yu Chen, Tsung-Shu Lin, Chen-Hsiang Lao, Wen-Hsin Wei, Hsien-Pin Hu | 2021-07-13 |
| 11037852 | 3DIC packaging with hot spot thermal management features | Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2021-06-15 |
| 11018073 | Heat spreading device and method | Tsung-Shu Lin, Hung-Chi Li, Tsung-Yu Chen | 2021-05-25 |
| 11004771 | Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices | Cheng-Chieh Hsieh, Chi-Hsi Wu, Shin-Puu Jeng, Tsung-Yu Chen | 2021-05-11 |
| 10978373 | Semiconductor device methods of manufacture | Shih-Chang Ku, Hung-Chi Li, Tsung-Shu Lin, Tsung-Yu Chen | 2021-04-13 |