Issued Patents 2021
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183399 | Semiconductor device and method of manufacture | Hsien-Pin Hu, Shang-Yun Hou, Chi-Hsi Wu, Chen-Hua Yu, Wen-Jung Chuang +6 more | 2021-11-23 |
| 11101140 | Semiconductor device and method of manufacture | Hsien-Pin Hu, Shang-Yun Hou, Chi-Hsi Wu, Chen-Hua Yu, Wen-Jung Chuang +6 more | 2021-08-24 |
| 11101260 | Method of forming a dummy die of an integrated circuit having an embedded annular structure | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more | 2021-08-24 |
| 11088079 | Package structure having line connected via portions | Chih-Kai Cheng, Tsung-Shu Lin, Tsung-Yu Chen, Hsien-Pin Hu | 2021-08-10 |
| 11069657 | Chip package having die structures of different heights and method of forming same | Hsien-Pin Hu, Shang-Yun Hou | 2021-07-20 |
| 11062971 | Package structure and method and equipment for forming the same | Wensen Hung, Tsung-Yu Chen, Tsung-Shu Lin, Chen-Hsiang Lao, Hsien-Pin Hu | 2021-07-13 |
| 10985137 | Stacked integrated circuit structure and method of forming | Wei-Ming Chen, Hsien-Pin Hu, Shang-Yun Hou | 2021-04-20 |
| 10964667 | Stacked integrated circuit structure and method of forming | Wei-Ming Chen, Hsien-Pin Hu, Shang-Yun Hou | 2021-03-30 |