Issued Patents 2021
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11101236 | Semiconductor package and method of forming the same | Kuan-Yu Huang, Li-Chung Kuo, Sung-Hui Huang, Shang-Yun Hou, Chien-Yuan Huang | 2021-08-24 |
| 11088079 | Package structure having line connected via portions | Chih-Kai Cheng, Tsung-Shu Lin, Hsien-Pin Hu, Wen-Hsin Wei | 2021-08-10 |
| 11088048 | Semiconductor structure | Chi-Hsi Wu, Wensen Hung, Tsung-Shu Lin, Shih-Chang Ku, Hung-Chi Li | 2021-08-10 |
| 11062971 | Package structure and method and equipment for forming the same | Wensen Hung, Tsung-Shu Lin, Chen-Hsiang Lao, Wen-Hsin Wei, Hsien-Pin Hu | 2021-07-13 |
| 11018073 | Heat spreading device and method | Tsung-Shu Lin, Wensen Hung, Hung-Chi Li | 2021-05-25 |
| 11004771 | Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices | Cheng-Chieh Hsieh, Chi-Hsi Wu, Shin-Puu Jeng, Wensen Hung | 2021-05-11 |
| 10985125 | Chip package structure | Kuan-Yu Huang, Sung-Hui Huang, Shu-Chia Hsu, Leu-Jen Chen, Yi-Wei Liu +4 more | 2021-04-20 |
| 10978373 | Semiconductor device methods of manufacture | Shih-Chang Ku, Hung-Chi Li, Tsung-Shu Lin, Wensen Hung | 2021-04-13 |
| 10897832 | Fan control based on a time-variable rate of current | Jenseng JS Chen, Jung-Tai Chen, Edward Yu-Chen Kung, Tzongli Lin, Bruce A. Smith | 2021-01-19 |